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    PCB Photoimageable White Solder Mask/ LPi White Solder Resist Ink

    White Photoimageable Solder Resist Ink for PCB(LB-1900W)LB-1900W is a series of photoimageable solder resist ink, which is also bi-component screen printing and UV contact exposure. The coated film pr

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    White Photoimageable Solder Resist Ink for PCB(LB-1900W)

    LB-1900W is a series of photoimageable solder resist ink, which is also bi-component screen printing and UV contact exposure. The coated film processed by high temperature hardening will be provided with high insulation and high solder resistance, which is specially designed for LED monitor and aluminum PCB, and the feature is more suitable for precise circuit board.

    A: Feature Introduction

    Technical Feature

    Color

    Bluish White/Milky White

    Viscosity

    VT-04F、25℃

    Major agent: 280±20PS, curing agent: 70±20PS,

    proportion of major agent against curing agent: 3/1

    Fineness

    Grindometer

    ≤5μm

    Hardness

    Pencil hardness tester

    ≥6H

    Adhesion

    Adhesion test,

    3M adhesive tape

    100/100

    Solder resisting

    Tin oven

    280℃×10s×2 times, no bubbles, no dropping

    Insulation resistance

    1.0×1012 Ohm

    Storing temperature

    26±2℃

    Packaging

    Major agent: 750g,

    curing agent:250g

    Shelf life

    6 months






    B: Operation Procedure

    Procedure

    Content

    (1)Dilution and viscosity adjustment

    To stir for 5-10 minutes till it’s well-proportioned. If the viscosity needs to be adjusted, 1-3% of the diluent can be added in. It’s recommended to use DBE diluent, butyl glycol(BCS).

    (2)Standing

    To stand for 10-15 minutes after fully stirring, and then to process screen printing.

    (3)

    Screen mesh

    Either 36T or 43T is available for screen mesh             

    Thickness of printing ink: between 25-30um.

    (4)Pre-curing

    A:To print and cure each side separately:

    The first side in hot air circulating oven: 75±5℃、15-20 minutes.

    The second side in hot air circulating oven: 75±5℃、20-25 minutes.

    B:To print and cure two sides at the same time.

    Hot air circulating oven:  75±5℃、25-30 minutes.

    (5)Exposure

    7K UV contact exposure: 500-700mj/c㎡       

    21-step sensitivity guide: 9-12 steps covered.

    (6)Developing

    Developing solution: (1±0.2%) of Na2CO3 Solution

    Temperature of developing solution: 30±2℃

    Developing time: 40-60 seconds

    Washing pressure: 1.8~2.2kg/c

    (7)posterior-curing

    Temperature: 150±5℃ Curing time: 60 minutes

    Matters need attention

    1. This type of printing ink only applies to the process of immersion nickel-gold and tin spraying, not for immersion tin or immersion silver, it can not be produced by UV machine.

    2. Parameters above are only for reference, the specific operation should be subject to samples.


    标签: PCB Solder Mask
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